Surface mount technology based on a new aramid/epoxy laminate

The concept of an organic hybrid circuit has been realized with high reliability on the both-sides copper-foil clad and the through-hole plated board, which has a combination of aramid-paper and epoxy resin. It has resulted in a small thermal-expansion value comparable to that of ceramics below its T/sub g/, and the level of ionic contamination has been reduced to the degree adaptable for a reliable semiconductor-chip on board.<
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