Quilt packaging: a new paradigm for interchip communication

"Quilt packaging," (QP) a new paradigm for interchip communication, is presented. QP uses conducting modules that protrude from the sides of integrated circuits to affect an enhanced-speed, reduced-power method of interfacing multiple die together within a package or on a multichip module. The concept of QP is introduced along with a discussion of advantages over traditional system-on-chip and system-in-package technologies. Details of a process flow and preliminary results are presented. Simulations show expected signal propagation between adjacent die of greater than 150 GHz.