Unpassivated high power deeply recessed GaN HEMTs with fluorine-plasma surface treatment

In this letter, unpassivated high power deeply recessed GaN-based high electron mobility transistors (HEMTs) are reported. The introduction of a thick graded AlGaN cap layer and a novel fluorine-plasma surface treatment reduced the gate-leakage current and increased breakdown voltage significantly, enabling the application of much higher drain biases. Due to excellent dispersion suppression achieved at an epitaxial level, an output power density of more than 17 W/mm with an associated power added efficiency (PAE) of 50% was measured at 4 GHz and V/sub DS/=80 V without SiN/sub x/ passivation. These results demonstrate the great potential of this novel epitaxial approach for passivation-free GaN-based HEMTs for high-power applications.