UWB chip antenna design using LTCC multilayer technology for mobile applications

A compact surface-mount ultra-wideband (UWB) chip antenna fabricated using multilayer low-temperature co-fired ceramic (LTCC) technology is presented. The antenna, suitable for mobile applications, is of a two layered metal-plate structure and occupies a compact size of 14 /spl times/ 10 /spl times/ 1.5 mm/sup 3/ only. With a very wide operating bandwidth of about 4.98 GHz, the antenna can cover the lower band of DS-UWB (3.1-4.85 GHz). The antenna radiation patterns at 4.0 GHz and the antenna gain are also measured and discussed.