Characterization and modeling of packages by a time-domain reflectometry approach

An approach that offers the possibility of characterizing different types of packages is presented. The types that will be discussed are plastic leadless chip carrier (PLLCC), ceramic leadless chip carrier (CLLCC), pin grid array (PGA), and flat pack all of which have a high input-output (I/O) lead count. The characteristics of a signal pin (track inside the package) and the coupling between neighboring pins for different configurations is determined in the time domain by a time-domain reflectometry approach.<
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