Simulation of mass flux divergence distributions for an evaluation of commercial test structures with tungsten-plugs

The evaluation of via structures, metallisations as well as a miniaturisation of the layout dimensions lead to the determination of new test structures. The time for prediction of the reliability of such structures should be very short but also effective. For instance for fast reliability prediction, constant power or constant current tests can be used. Due to a change in fault mechanisms an extrapolation to working conditions is sometimes difficult. Simulations can help in prediction of the failure mechanism as well as the determination of the weakest link in the structures. In this study the void location as well as the mass flux divergence distribution of a conventional tungsten-plugged metallisation structure was investigated by finite element simulation (using ANSYS/spl reg/). A calculation routine is used for the determination of the mass flux divergences and the void formation in the model. The suitability of the simulation in test structure design will be shown. Based on the default models the overlap of the metallisation, the metallisation length, and width and the applied current density was varied. The stress free temperature was set to 450/spl deg/C. This temperature was taken from the last process step. The substrate temperature was set to 150/spl deg/C like the temperature in the reliability stress test. The mechanical stress and temperature and current density distribution as well as the influence of the different migration mechanism was determined. Using these results the void formation and its localisation was calculated and compared with the measurement.