DNA assembly of component arrays for nanoscale electronics

A method for assembling arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We discuss the programmed self-assembly based on in situ hybridization of DNA-functionalized components to a pre-assembled 2D DNA scaffolding on a surface. We show that arrays of prototype electronic components composed of Au nanoparticles and nanowires can be assembled on a surface with high precision. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.