E-beam direct wafer writing process using water-soluble conductive layer (WSCL)

An E-beam direct wafer writing process using a Water Soluble Conductive Layer (WSCL) is described. WSCL is ammonium poly(p-styrene sulfonate) having ion conductivity and water solubility. The WSCL process consists of applying a thin WSCL to the e-beam resist surface prior to the conventional exposure step. WSCL is subsequently removed and the e-beam resist developed in the ordinary way. The WSCL process has general utility for various resists, eliminating charging effects caused by e-beam exposure.