Impurity gettering of polycrystalline solar cells fabricated from refined metallurgical-grade silicon

A damage-gettering technique is described which reduces the impurity content in grown crystals and enhances cell performance of diffused solar cells. Crystalline ingots were Czochralski-grown from an acid-leached metallurgical-grade source. Damage gettering was performed by preparing a mechanically damaged layer on the wafer back surface and subsequent annealing. Optimum annealing conditions were investigated as a function of ambient gas species, temperature, and time. In an O
2
ambient, the fill factor of the cells degraded to 0.25, while cell performance was greatly improved by annealing in N
2
. Conversion efficiency tends to increase with annealing time at higher temperatures. Maximum conversion efficiencies attained for mono- and polycrystalline solar cells fabricated from MG-Si are 9.8 and 7.7 percent, respectively. Light current-voltage characteristics and the leakage-current variations with depth were analyzed. It was found that impurity gettering begins at the wafer surfaces and proceeds gradually into the bulk regions.