Cantilever fabrication without sacrificial layer -application of metal transfer process to MEMS

Overhang structures are often used in microelectromechanical systems. An overhang structure has to be fixed on a sacrificial layer during fabrication in the conventional process. The sacrificial layer has to be removed in the final step of the process. The overhang structure often sticks to the substrate by capillary force. In a transfer process a desired pattern is fabricated on a dummy substrate and the pattern is bonded on a desired substrate (main substrate) using an adhesive layer [1],[2]. An overhang structure can be obtained on the main substrate without a sacrificial layer. In this study, nickel cantilevers are fabricated by the transfer process. An epoxy resin is used as the adhesive layer. Cantilever vibrations are observed by applying AC voltage between the cantilever and the counter electrode. In order to develop the transfer process, new techniques is also shown.