Development of high-Q embedded passive library for RF-SOP module applications

Scalable broadband modeling techniques have been developed for the high-Q passive components buried into the organic laminate package substrate. Based on modified-T equivalent circuits, the developed models can achieve an effective bandwidth several times larger than the conventional PI models. For scalability, the fundamental reactive elements in a modified-T model can be converted directly from those in an existing scalable PI model. Curve-fitting techniques are particularly applied for the peak Q factors and the resonant frequencies that can be further converted into the resistive elements and the higher-order reactive elements, respectively, to form a complete modified-T model. In this paper, the proposed scalable modeling techniques have accomplished the automatic generation of broadband lumped models for designing the embedded passives in a 4-layer BT (Bismaleimide Triazine) laminate, one of today's most popular package substrate, quite successfully.