Leveraging a low pressure thermal module to meet the challenges of advanced device manufacturing

Fulfilling the needs of advanced semiconductor device manufacturing presents continued challenges to the developers and manufacturers of capital equipment. More than twenty years of RTP equipment evolution and development has resulted in the availability of a select few technologies that are capable of delivering the demanding performance required to manufacturer today's advanced semiconductor devices. This paper describes the development and characterization of a new low pressure RTP process module that was developed to fulfil some specific needs. With the use of proven existing thermal processing technology, the design, development, characterization and qualification of this module for device manufacturing was done in a very short period of time.