A two dimensional dynamic cellular automata model for simulation of photoresist etching process

A two dimensional (2D) dynamic cellular automata (CA) model is presented for photoresist etching process simulation for the first time. In the dynamic CA model, only boundary cells are processed in pertinent etch step, so the simulation speed is greatly increased. The model has been tested using some well-known etch-rate distribution test functions and is found to be stable even in areas where the fluctuation in etch rates is very sharp.