Technological issues for micromachining of new passive THz-components based on deep-trench silicon etching

We present a survey of the application of micromachining techniques for the fabrication of THz-components. Micro-machining of new THz- devices based on deep trench etching of silicon is discussed with respect to its capability to generate complex 3-dimensional geometries with high aspect ratios (ARs) and to meet the high mechanical requirements for THz-components. First results for the application of deep trench etching for the design of a branch-line coupler for 600 GHz is discussed. We emphasize the potential of silicon based microstructures for manufacturing new devices and focus on technological issues.