Temperature compensated LiTaO/sub 3//sapphire bonded SAW substrate with low loss and high coupling factor suitable for US-PCS application

A novel temperature-compensated SAW substrate was developed based on bonded LiTaO/sub 3//sapphire. Because of its small TEC (thermal expansion coefficient) and large Young's modulus, sapphire is an ideal material for a support substrate. The frequency and temperature characteristics of the bonded LiTaO/sub 3//sapphire SAW substrate and its application to a US-PCS duplexer are described.