ABCD modeling of crosstalk coupling noise to analyze the signal integrity losses on the victim interconnect in DSM chips

The paper proposes an ABCD modeling approach to model the crosstalk coupling noise on the victim interconnect due to single/multiple aggressor(s) in deep sub-micron (DSM) chips. After the order reduction the crosstalk model is utilized for the analysis of crosstalk coupling noise on the victim's far end signal. Various timing issues related to signal waveform such as, delay time, overshoot and undershoot occurrence time etc., that in effect help to ensure in prior the desired signal integrity (SI) and performance reliability of the SoCs, can be estimated analytically using the reduced order crosstalk model. It has been observed that the crosstalk coupling noise introduces the delay in the victim's far end signal which can be significant enough or even unacceptable if many aggressors simultaneously couple energy to the victim line, or the line spacing between the aggressor and victim is reduced due to manufacturing defect such as under-etching or even, length of the victim interconnect is increased due to improper layouts of / routings between cores and devices on chips. Influences of other interconnect parasitics on the victim's far end signal can also be analyzed using the same model. Simulation results obtained with the proposed reduced order model is found to be quite comparable to the accuracy of the PSPICE simulation.