Evaluation of embedded heat extraction for high power density integrated electromagnetic power passives

The use of embedded solid-state heat extractors to increase the power densities in power electronic modules seems promising. Cross-sectional geometric optimisation was done on heat extraction insert and it was found that the most suitable heat extraction configuration for application in power electronics is the use of flat continuous heat extraction layers aiding in conducting heat to externally mounted heat sinks. Theoretic expected thermal enhancement factors were determined and experimentally verified. Interfacial thermal resistances adversely influence the effectiveness of heat extraction inserts and should be minimised.