Grounding requirements for optimum performance results with X2Y/sup /spl reg// Technology on a printed circuit board

With the introduction of the X2Y/sup /spl reg// Technology in decoupling applications, a critical scientific study investigating and documenting the technology's attachment relationship to a printed circuit board's power and ground planes is needed. The paper tests and documents the performance of the X2Y/sup /spl reg// Technology in a Circuit 2 configuration, utilizing different land pad configurations.