70% TMR at room temperature for SDT sandwich junctions with CoFeB as free and reference Layers

Spin dependent tunneling (SDT) wafers were deposited using dc magnetron sputtering. SDT junctions were patterned and connected with one layer of metal lines using photolithography techniques. These junctions have a typical stack structure of Si(100)-Si/sub 3/N/sub 4/-Ru-CoFeB-Al/sub 2/O/sub 3/-CoFeB-Ru-FeCo-CrMnPt with the antiferromagnet CrMnPt layers for pinning at the top. High-resolution transmission electron microscopy (HRTEM) reveals that the CoFeB has an amorphous structure and a smooth interface with the Al/sub 2/O/sub 3/ tunnel barrier. Although it is difficult to pin the amorphous CoFeB directly from the top, the use of a synthetic antiferromagnet (SAF) pinned layer structure allows sufficient rigidity of the reference CoFeB layer. The tunnel junctions were annealed at 250/spl deg/C for 1 h and tested for magneto-transport properties with tunnel magnetoresistive (TMR) values as high as 70.4% at room temperature, which is the highest value ever reported for such a sandwich structure. This TMR value translates to a spin polarization of 51% for CoFeB, which is likely to be higher at lower temperatures. These junctions also have a low coercivity (Hc) and a low parallel coupling field (Hcoupl). The combination of a high TMR, a low Hc, and a low Hcoupl is ideal for magnetic field sensor applications.