Water cooling study of natural convection heat transfer from simulated electronic chips during power-on transient period

Experiments are performed using water to study the natural convection heat transfer during power-on transient period from in-line four simulated flush mounted electronic chips. The heat flux ranges from 0.1 W/cm/sup 2/ to 0.6 W/cm/sup 2/. The effect of heat fluxes, geometric parameters such as chip numbers are investigated. Correlations are presented for individual chips as well as for overall data in the transient regime.