Mirror coating and packaging for a horizontal MEMS optical switch array

A prototype package for a microelectromechanical system (MEMS) optical ON-OFF switch array has been designed, fabricated and assembled. The package consists of a horizontal surface micromachined 3D PolyMUMPs mirror chip, optical fibers and a micro-bench which acts as a carrier for the MEMS chip and optical fiber assemblies. The packaging alignment was achieved using an auto-alignment system. A multi-layer dielectric optical coating has also been designed and applied to enhance the optical performance of the mirrors. The packaged MEMS optical switch has been characterized.