Impact of component technologies and physical design methodologies on high density wireless products

Advances in the capability of IC packaging, component technologies, and printed circuit board manufacturing has given wireless product designers the ability to develop highly functional devices in small form factors. Technologies such as 2D and 3D chip scale packages (CSP), 0201 microcomponents, high density circuit boards, and embedded/integrated substrates have enabled portable wireless products with digital pad densities greater than 600 pads/in/sup 2/ when only two years ago pad densities were <350 pads/in/sup 2/. This paper discusses the methodology developed and tools deployed to select the appropriate component technology and enable high-density physical designs. It provides an in-depth look at the system-level approach used to enable high-density designs in 3G and iDEN/spl reg/ wireless phones and public safety radios which integrate high pin count 0.5 mm micro-BGAs, multi-layer high density interconnect printed circuit boards, and 0201 chip components.