Improving the reliability of the plastic IC package in reflow soldering process by optimization

In order to reduce stress in the plastic small outline J-lead (SOJ) package and prevent the interface delamination under the infrared (IR) soldering process, parameterization, parametric study and optimization are used. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the constraint optimization to the parameterized integrated circuit (IC) package.