Reliability research on the thermal deformation and thermal stress of the metal packaging with low resistance and high electric current

Thermal deformations and stresses of packaging structures were investigated by both experimental and numerical methods. Laser speckle interferometry was used as the experimental method to test the coefficient of thermal expansion (CTE) of the metal composite leads and the thermal deformations of the entire packaging structures due to the change of temperature from room-temperature to 150/spl deg/C. ABAQUS/standard finite element (FE) code was used to simulate the thermal deformations and stresses from room-temperature to 150/spl deg/C for the-packaging structures. The results of numerical simulations were in good agreement with those of experiments. It showed that the predicted thermal stresses and deformations in the working condition were qualitatively reliable. Moreover, the technique of element deactivation and activation was used in the FE analysis to simulate the manufacturing process of the packaging structures cooled from 779/spl deg/C to room-temperature. The residual thermal deformations and stresses during the process were obtained.