Effect of underlayer on sputtered aluminum grain structure and its correlation with step coverage in submicron vias

Summary form only given. The grain size and intragrain roughness of aluminum films has been studied for various underlayers under the same deposition conditions. Intragrain roughness is shown to correlate with breaks in Al step coverage on via sidewalls. It is concluded that the best step coverages will be obtained for those underlayers and deposition conditions which produce the minimum intragrain roughness.<
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