Room temperature wafer bonding by elastomeric polymer-supported cold welding

Elastomer supported cold welding is applied as a wafer bonding technique. By placing the elastomeric polymer layer beneath the metal contact surfaces, two silicon wafers under limited load (/spl sim/ 3 KPa) at 25 /spl deg/C. This method for room temperature wafer bonding without applying a voltage, high pressure, or vacuum is applicable for MEMS and NEMS packaging and fabrication processes.