A new open-hole buried heterostructure process for the fabrication of photonic integrated circuits

We have successfully fabricated several batches of open-hole buried heterostructure (BH) lasers using self-align technique with a hole of about 3 /spl mu/m opening. This new processing technology have in the active region, a traditional buried heterostructure (BH) with semiinsulating InP which works as a current block material. While in the passive region, the semiinsulating InP is the waveguide cladding material. The proposed method is very important for integrated photonic devices. Using this method we will be able to develop sophisticated photonic circuits with very good performance for future optical networking applications.