Microcarrier for LSI chip used in the HITAC M-880 processor group

The compact chip carrier named MCC has been developed for high density chip level packaging. The MCC realizes the smallest possible hermetic chip package by introducing full surface flip-chip interconnections, thin-film process technology, built-in termination resistors, and a thermal expansion matched ceramic substrate. The structure of the MCC and the thin-film process technology for its fabrication are reported.<
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