Wavelet-based neural network prediction of plasma etch profile nonuniformity

Summary form only given, as follows. Profiles of plasma etching have conventionally been characterized by approximating the slope with an angle or anisotropy. This is critically limited in that detailed variations on the profile surface are inevitably neglected. In current high density plasma etching, this becomes more serious since unexpected microfeatures such as bowing or microtrenching are frequently formed along the profile surface.