A high performance electrical and optical interconnection technology

A printed circuit board technology has been developed for high-speed, high-density electronic circuits built from components with high power dissipation. The technology consists of a metal core with discrete conductors at both sides. Low thermal resistance has been realized by placing the component packages against the metal core. The edges of the metal can be contacted to heat sinks or conducting board guides. The board technology has been characterized for both electrical and thermal performance (natural and forced convection) and validated as an alternative technology for a high-performance system. Electrical design rules for high-speed interconnections have been established. It is projected that, in the future, the interconnection density will be increased and more unconventional cooling mechanisms such as conduction or liquid cooling will be used.<
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