The characteristics of large area processing plasmas

In order to improve production efficiency, large-diameter wafer substrates (300-mm diameter) and large-area glass substrates (from 400 cm/sup 2/ to 1 m/sup 2/) have been adopted recently. As a result, the development of large and high-density plasma source has become essential. To investigate the discharge phenomenon in the chamber that consists of embedded antenna coil in the rectangular system (1020 /spl times/830 /spl times/437 mm), we have developed a two-dimensional fluid simulation model. In order to check our model, the results from our simulation have been compared with available experimental data. The comparison is generally in a good agreement with experiments. Depending on the current direction and powered method, the distribution of plasma parameters has many differences. In our simulation with a chamber larger than is usually used in other experiments, we examine three effects: the distance between antenna coils, structure in the chamber, and the depth of the chamber. The parameters, which affect nonuniformity, electron temperature, and others, can be explained in a manner similar to the inductively coupled plasma source with a cylindrical chamber. Our simulation results confirm that the embedded antenna coil system with a suitable environment can be extended by many antenna coils as a large-area plasma source.