RF modeling of ball grid array packages using a coupled transmission line model

A novel method for radio-frequency (RF) modeling of ball grid array (BGA) packages is presented. A new analytical method is developed to extract the inductance characteristics of the package bond wires. With the extracted bond wire data, a cascaded multi-section coupled transmission line model is setup to describe the physical trace structures of the BGA packages. The multi-section /spl pi/ model representing the coupled transmission line effect of the signal traces is used for the RF modeling of the BGA packages. The BGA packages with open-path, short-path, through-path, and through-ground test configurations are studied. The simulated S parameter results exhibit very good agreement with the measured ones for the BGA packages.