Flip Chip design of dual band/tri mode SiGe BiCMOS transmitter IC for CDMA wireless applications

Flip Chip circuit design for highly integrated transmitter IC for CDMA handset is presented. The RF flip chip implementation uses peripheral I/O bumps pattern and internal ground bumps within the die, directly on the top metal layer. The IC transmitter is designed to deliver 8 dBm in CDMA mode in cellular band, 11 dBm in AMPS mode and 9 dBm in CDMA mode in PCS band at 90, 88, 108 mA, respectively. Results show that flip chip implementation meets or exceeds the wirebond RFIC performance.