High-frequency IC packaging technologies

Recent low-cost and high-performance packaging technology for high frequency applications such as millimeter-wave sensor applications is described in this paper. A flip-chip package and millimeter-wave integrated circuit (MMIC) technologies for commercial use low-cost 76-GHz automotive radar sensors are demonstrated. We employed a through-hole package that provides low-cost manufacturing and good RF performances for the radar sensor. The key to success of utilizing the flip-chip packages is in stabilization of MMICs.