Polymer micro-heat-pipe for InP/InGaAs integrated circuits

This paper reports a polymer-based technology suitable for implementation of micro-heat-pipes for low temperature InP/InGaAs based processes. Many published approaches for implementing heat pipes at micro scale require wafer-to-wafer bonding and sintering. The temperature required for standard wafer-to-wafer bonding or sintering is normally in excess of 500/spl deg/C and is beyond the thermal budget of many low temperature InP/InGaAs-based processes. This technology enables a heat-pipe to be miniaturized with mainly organic materials at a temperature below 110/spl deg/C, eliminating the needs for high-temperature wafer-to-wafer bonding and sintering. Measurements have been carried out and are presented to substantiate this presentation.