Development of novel ultra-high dielectric constant polymer based composite

Embedded capacitor technology can increase silicon packing efficiency, improve electrical performance, and reduce electronic assembly cost compared with traditional discrete capacitor technology. Developing a suitable material that satisfies electrical, reliability and processing requirements is one of the major challenges of incorporating capacitors into a printed wiring board (PWB) substrate for demanding wireless, RF portable telecommunication products. A novel epoxy-based composite with very ultra high dielectric constant (/spl epsiv//sub r//spl sim/1000) has been developed in this work. The previous record of /spl epsiv//sub r/=150 was only recently reported. To our best knowledge, this is the highest K value of the polymer based composite ever reported. High dielectric constant is obtained by increasing the concentration of conductive filler close to but not exceed the percolation threshold within the polymer matrix. This novel ultra high K material also has low dielectric loss (<0.02), good adhesion and perfect multi-chip-module laminate (MCM-L) process compatibility. An embedded capacitor prototype with capacitance density of 100 nF/cm/sup 2/ has been manufactured using this composite and spin coating technology. This novel composite is the perfect material candidate for the integral embedded capacitor applications for next generation electronic products.