Packaging of a fiber optical MEMS switch

In this paper, packaging of a Microelectromechanical System (MEMS)-based fiber optical switch was implemented along with the investigation on the related packaging techniques. A subpackage was formed as the first level encapsulation to house the MEMS chip. The results from fiber coupling test indicate a good alignment accuracy aided by the combination of rectangular shape fiber groove and fiber stopper. The packaging quality was evaluated through tensile test and cross section analysis.