Polymer micro-heat-pipe for InP/InGaAs technologies

This paper reports a polymer micro-heat-pipe technology suitable for cooling of InP/InGaAs power devices. This technology eliminates the needs for high-temperature wafer-to-wafer bonding and can be carried out at a temperature below 110/spl deg/C. By estimation from the measured data, the effective thermal conductivity of a fabricated micro-heat-pipe suggests that this technology can serve as a potential solution to some thermal management problems in InP/InGaAs processes.