Wafer bonding for the fabrication of high-performance photodetectors: a mature technology ?

Summary form only given. Significant progress has been achieved towards the demonstration of direct wafer bonded photodetectors. This device design approach offers the freedom to combine dissimilar materials in order to fabricate novel device structures not obtainable using standard techniques. Significant device performance advantages have been demonstrated in specific device applications using wafer bonding. The results summarized here demonstrate additional progress towards defining wafer bonding as a mature technology - a manufacturable and cost-effective process applied to APDs that portends commercial application.