Placement for productibility and assembly: information requirements

The information requirements of board-level electronics design and assembly processes are surveyed in an effort to identify and explain the importance of proper information utilization in electronics design. The information discussed is used to develop a methodology for placing microelectronic components on mixed-technology printed wiring boards as a function of component mix, component types, the number of sides of the printed wiring board to be populated, and the abilities of the production equipment. As part of this methodology, a decision tree for selecting the en masse soldering technologies to be employed in the production of a design is presented. Additionally, a hierarchy for selecting the board-level assembly process plan as justified by the technologies and techniques employed in its assembly is discussed.<
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