Miniaturized Wire Wrap

Miniaturization and micro-miniaturization are key words that are often heard in the electronic industry today. The increasing frequency of these terms reflects the growing importance attached to the reduction in size, of logic and power components used for data processing applications. In fact, miniaturization is now a primary project of many scientific research teams throughout the industry. The success of these projects is evidenced by the wide variety of small, smaller, and ultra-small computer components presently available. However, one aspect of the miniaturization program that has not kept pace with the primary effort, is the aspect of inter-component connections. There still exists in this area, a serious problem of developing and implementing an electrical communications scheme that can function between components of increasingly greater logical density. This paper proposes an effective connection scheme based on the "solderless wire wrap" technique.