Heat Transfer Correlatins for Use in Naturally Cooled Enclosures with High-Power Integrated Circuits

Heat transfer rates were experimentally measured in an air-filled two-dimensional simplified model of a naturally cooled rectangular enclosure with a concentrated energy source representing a high-power integrated circuit (IC). The aspect ratio of the enclosure and the size and location of the source were parametrically varied. Correlations are presented such that a component temperature rise can be estimated if the energy dissipation rate is known in a specified design.