Thin Copper-Clad Laminates for Multi-Layer Printed Circuit Boards

This paper discusses the production of thin copper-clad laminates which are used in the manufacture of multi-layer printed circuit boards. Copper-clad laminates of conventional thickness are relatively easy to produce, to test and to use, whereas the thin laminates present some problems to both producer and user. These problems as well as the properties of thin laminates are discussed.