Electrically Insulative Adhesives for Hybrid Microelectronic Fabrication

Four insulative adhesives for attachment of alumina substrates to metallic headers in hermetically sealed packages have been evaluated. Tests were performed to determine long-term reliability of the epoxies and to select the most suitable adhesive for use in a highrate hybrid production facility. The adhesive selected for use was a Bstage film epoxy having superior lap shear strength with all platings tested, long pot life, and ease of application in film form.