Ti added Nb3Sn wires by new fabrication processes

The new fabrication processes for Ti addition to Nb
3
Sn have been developed. Using the pure Ti around Nb cores and sufficient Sn by internal plating, we have been able to get the good workability during drawing to a final diameter and the high critical current density at a higher field than 14 T. Several characteristics of both Ti foil and Ti rod processes have been discussed about the effect of Ti addition to Nb
3
Sn.