Application of thin film head technology to a high performance head/track disk file

Processing technologies and performance parameters of thin film recording heads used in a 6.7Mbyte disk memory are presented. Photolithographic, vacuum deposition, and ceramic substrate fabrication procedures are described for a single turn, multi-track head assembly. Interlayer diffusion and thermal heating are described. Data relating spacing loss, bit density, gap geometry, and write currents to signal amplitude and timing are given for NiCo media. Special cables and integrated write/read IC's are described.