Extraction method of multiline parameters for printed circuit board interconnects

This paper proposes a modified technique for extracting electrical parameters of transmission lines on printed circuit boards (PCBs). This approach results in the generation of a hybrid measurement technique that is used in conjunction with TDR (time domain reflectometry) measurement in the time domain, S-parameter measurement in the frequency domain, and empirical design data, to obtain realistic consideration points for future PCB design. While the conventional methods cover parameter extraction of a single line, this proposed method can be extended to that of multi-coupled lines.