A process for surface texturing of Kapton polyimide to improve adhesion to metals

It is noted that polyimide undergoes a surface texturing process when seeded with a thin layer of copper and subjected to a high-temperature (above 400 degrees C) treatment in air. During this heating process, copper undergoes a clustering and migration process and initiates a copper-catalyzed degradation localized around the vicinity of the cluster particles to impart a textured surface leads to improved adhesion, predominantly due to mechanical anchoring. Adhesion values of 7-10 lb/in (ambient) and 4-6 lb/in (after solder float test) have been obtained. High retention of adhesion under 85 degrees C/85% relative humidity and 150 degrees C aging is obtained when textured Kapton is seeded with palladium and plated with electroless nickel.<
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