Combination of numerical and experimental methods for stress analysis of small electronic components

Examples of the development of a multichip module with extremely loaded components are presented. It is shown that a reasonable combination of experimental methods, e.g. holographic interferometry, metallography, and a good knowledge of the specific material behavior under working conditions result in better numerical simulation under realistic boundary conditions. This allows shape and material optimization during the development phase to achieve components with high reliability in a short development time.<
>