Modeling complex via hole structures

Derives a physics-based circuit model for complex via hole structures in printed circuit boards. The via hole is modeled as a cascade of capacitance and inductance matrices. Capacitance values are computed using a three-dimensional electrostatic solver and inductance values are computed from a two-dimensional quasi-TEM solver. This model is valid at frequencies up to a few gigahertz for typical via hole geometries, where the return current follows a well defined path.